XC5VLX110-1FFG1760C vs XC5VLX110-1FF1153C feature comparison

XC5VLX110-1FFG1760C AMD Xilinx

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XC5VLX110-1FF1153C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1760 BGA-1153
Pin Count 1760 1153
Reach Compliance Code compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B1760 S-PBGA-B1153
JESD-609 Code e1 e0
Length 42.5 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8640 8640
Number of Inputs 800 800
Number of Logic Cells 110592 110592
Number of Outputs 800 800
Number of Terminals 1760 1153
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 8640 CLBS 8640 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1760,42X42,40 BGA1153,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.4 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 35 mm
Base Number Matches 1 1

Compare XC5VLX110-1FFG1760C with alternatives

Compare XC5VLX110-1FF1153C with alternatives