XC5VFX70T-3FF665C
vs
XC5VFX70T-3FF1136C
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA-665
BGA-1136
Pin Count
665
1136
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Combinatorial Delay of a CLB-Max
0.67 ns
0.67 ns
JESD-30 Code
S-PBGA-B665
S-PBGA-B1136
JESD-609 Code
e0
e0
Length
27 mm
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
5600
5600
Number of Inputs
360
640
Number of Logic Cells
71680
71680
Number of Outputs
360
640
Number of Terminals
665
1136
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
5600 CLBS
5600 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA665,26X26,40
BGA1136,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.9 mm
3.25 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
35 mm
Base Number Matches
1
1
Compare XC5VFX70T-3FF665C with alternatives
Compare XC5VFX70T-3FF1136C with alternatives