XC5VFX70T-3FF665C vs XC5VFX70T-3FF1136C feature comparison

XC5VFX70T-3FF665C AMD Xilinx

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XC5VFX70T-3FF1136C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-665 BGA-1136
Pin Count 665 1136
Reach Compliance Code unknown unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.67 ns 0.67 ns
JESD-30 Code S-PBGA-B665 S-PBGA-B1136
JESD-609 Code e0 e0
Length 27 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 5600 5600
Number of Inputs 360 640
Number of Logic Cells 71680 71680
Number of Outputs 360 640
Number of Terminals 665 1136
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 5600 CLBS 5600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA665,26X26,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.9 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 35 mm
Base Number Matches 1 1

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Compare XC5VFX70T-3FF1136C with alternatives