XC5VFX70T-2FFV665C
vs
XC5VFX70T-2FFG1136I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
BGA-665
|
BGA-1136
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Combinatorial Delay of a CLB-Max |
0.77 ns
|
0.77 ns
|
| JESD-30 Code |
S-PBGA-B665
|
S-PBGA-B1136
|
| JESD-609 Code |
e1
|
e1
|
| Length |
27 mm
|
35 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
5600
|
5600
|
| Number of Inputs |
360
|
640
|
| Number of Logic Cells |
71680
|
71680
|
| Number of Outputs |
360
|
640
|
| Number of Terminals |
665
|
1136
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
5600 CLBS
|
5600 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA665,26X26,40
|
BGA1136,34X34,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
2.9 mm
|
3.25 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
27 mm
|
35 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
1136
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare XC5VFX70T-2FFV665C with alternatives
Compare XC5VFX70T-2FFG1136I with alternatives