XC5VFX70T-2FFV1136I vs XC5VFX70T-2FFV1136C feature comparison

XC5VFX70T-2FFV1136I AMD

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XC5VFX70T-2FFV1136C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description BGA-1136 BGA-1136
Reach Compliance Code compliant unknown
Combinatorial Delay of a CLB-Max 0.77 ns 0.77 ns
JESD-30 Code S-PBGA-B1136 S-PBGA-B1136
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 5600 5600
Number of Inputs 640 640
Number of Logic Cells 71680 71680
Number of Outputs 640 640
Number of Terminals 1136 1136
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 5600 CLBS 5600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1136,34X34,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.25 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 2 2
ECCN Code 3A991.D
HTS Code 8542.39.00.01

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