XC5VFX70T-2FF665C
vs
XC5VFX70T-2FFG1136I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
XILINX INC
Package Description
BGA-665
BGA-1136
Reach Compliance Code
not_compliant
compliant
Combinatorial Delay of a CLB-Max
0.77 ns
0.77 ns
JESD-30 Code
S-PBGA-B665
S-PBGA-B1136
JESD-609 Code
e0
e1
Length
27 mm
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
5600
5600
Number of Inputs
360
640
Number of Logic Cells
71680
71680
Number of Outputs
360
640
Number of Terminals
665
1136
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
5600 CLBS
5600 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA665,26X26,40
BGA1136,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.9 mm
3.25 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
35 mm
Base Number Matches
2
2
Part Package Code
BGA
Pin Count
1136
ECCN Code
3A991.D
HTS Code
8542.39.00.01
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