XC5VFX70T-1FFV665I vs XC5VFX70T-1FFV1136I feature comparison

XC5VFX70T-1FFV665I AMD

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XC5VFX70T-1FFV1136I AMD

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Package Description BGA-665 BGA-1136
Reach Compliance Code compliant compliant
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B665 S-PBGA-B1136
JESD-609 Code e1 e1
Length 27 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 5600 5600
Number of Inputs 360 640
Number of Logic Cells 71680 71680
Number of Outputs 360 640
Number of Terminals 665 1136
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 5600 CLBS 5600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA665,26X26,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.9 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 35 mm
Base Number Matches 2 2