XC5VFX70T-1FFG1136C
vs
XC5VFX70T-1FFV665I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
BGA-1136
|
BGA-665
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
AMD
|
|
| Combinatorial Delay of a CLB-Max |
0.9 ns
|
0.9 ns
|
| JESD-30 Code |
S-PBGA-B1136
|
S-PBGA-B665
|
| JESD-609 Code |
e1
|
e1
|
| Length |
35 mm
|
27 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
5600
|
5600
|
| Number of Inputs |
640
|
360
|
| Number of Logic Cells |
71680
|
71680
|
| Number of Outputs |
640
|
360
|
| Number of Terminals |
1136
|
665
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
5600 CLBS
|
5600 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1136,34X34,40
|
BGA665,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.25 mm
|
2.9 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
35 mm
|
27 mm
|
| Base Number Matches |
2
|
2
|
|
|
|