Findchips: Compare XC5VFX70T-1FFG1136C vs XC5VFX70T-1FFV665I

XC5VFX70T-1FFG1136C vs XC5VFX70T-1FFV665I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	XILINX INC	ADVANCED MICRO DEVICES INC
Part Package Code	BGA
Package Description	BGA-1136	BGA-665
Pin Count	1136
Reach Compliance Code	compliant	compliant
ECCN Code	3A991.D
HTS Code	8542.39.00.01
Combinatorial Delay of a CLB-Max	0.9 ns	0.9 ns
JESD-30 Code	S-PBGA-B1136	S-PBGA-B665
JESD-609 Code	e1	e1
Length	35 mm	27 mm
Moisture Sensitivity Level	4	4
Number of CLBs	5600	5600
Number of Inputs	640	360
Number of Logic Cells	71680	71680
Number of Outputs	640	360
Number of Terminals	1136	665
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Organization	5600 CLBS	5600 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1136,34X34,40	BGA665,26X26,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	245	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	3.25 mm	2.9 mm
Supply Voltage-Max	1.05 V	1.05 V
Supply Voltage-Min	0.95 V	0.95 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	35 mm	27 mm
Base Number Matches	2	2
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays