XC5VFX200T-1FFG1738C
vs
XC5VFX200T-2FFG1738I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA-1738
BGA-1738
Pin Count
1738
1738
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.7.A
HTS Code
8542.39.00.01
8542.39.00.01
Combinatorial Delay of a CLB-Max
0.9 ns
0.77 ns
JESD-30 Code
S-PBGA-B1738
S-PBGA-B1738
JESD-609 Code
e1
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
4
4
Number of CLBs
15360
15360
Number of Inputs
960
960
Number of Logic Cells
196608
196608
Number of Outputs
960
960
Number of Terminals
1738
1738
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
15360 CLBS
15360 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1738,42X42,40
BGA1738,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.25 mm
3.25 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Compare XC5VFX200T-1FFG1738C with alternatives
Compare XC5VFX200T-2FFG1738I with alternatives