XC5VFX130T-2FFG1738I vs XC5VFX130T-2FF1738C feature comparison

XC5VFX130T-2FFG1738I AMD Xilinx

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XC5VFX130T-2FF1738C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1738 BGA-1738
Pin Count 1738 1738
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.77 ns 0.77 ns
JESD-30 Code S-PBGA-B1738 S-PBGA-B1738
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 10240 10240
Number of Inputs 840 840
Number of Logic Cells 13172 13172
Number of Outputs 840 840
Number of Terminals 1738 1738
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 10240 CLBS 10240 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1738,42X42,40 BGA1738,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.25 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

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Compare XC5VFX130T-2FF1738C with alternatives