Findchips: Compare XC5VFX130T-2FF1738I vs XC5VFX130T-2FF1738C

XC5VFX130T-2FF1738I vs XC5VFX130T-2FF1738C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	BGA-1738	BGA-1738
Pin Count	1738	1738
Reach Compliance Code	not_compliant	not_compliant
ECCN Code	3A001.A.7.A	3A001.A.7.A
HTS Code	8542.39.00.01	8542.39.00.01
Combinatorial Delay of a CLB-Max	0.77 ns	0.77 ns
JESD-30 Code	S-PBGA-B1738	S-PBGA-B1738
JESD-609 Code	e0	e0
Length	42.5 mm	42.5 mm
Moisture Sensitivity Level	4	4
Number of CLBs	10240	10240
Number of Inputs	840	840
Number of Logic Cells	13172	13172
Number of Outputs	840	840
Number of Terminals	1738	1738
Operating Temperature-Max	100 °C	85 °C
Operating Temperature-Min	-40 °C
Organization	10240 CLBS	10240 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1738,42X42,40	BGA1738,42X42,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.25 mm	3.25 mm
Supply Voltage-Max	1.05 V	1.05 V
Supply Voltage-Min	0.95 V	0.95 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	OTHER
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	42.5 mm	42.5 mm
Base Number Matches	2	2
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays