XC5VFX130T-1FF1738I
vs
XC5VFX130T-2FF1738C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
XILINX INC
Package Description
BGA-1738
BGA-1738
Reach Compliance Code
not_compliant
not_compliant
Samacsys Manufacturer
AMD
Combinatorial Delay of a CLB-Max
0.9 ns
0.77 ns
JESD-30 Code
S-PBGA-B1738
S-PBGA-B1738
JESD-609 Code
e0
e0
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
4
4
Number of CLBs
10240
10240
Number of Inputs
840
840
Number of Logic Cells
13172
13172
Number of Outputs
840
840
Number of Terminals
1738
1738
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
10240 CLBS
10240 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1738,42X42,40
BGA1738,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.25 mm
3.25 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
2
2
Part Package Code
BGA
Pin Count
1738
ECCN Code
3A001.A.7.A
HTS Code
8542.39.00.01
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