Findchips: Compare XC5VFX100T-2FF1136I vs XC5VFX100T-1FFG1136I

XC5VFX100T-2FF1136I vs XC5VFX100T-1FFG1136I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	BGA-1136	BGA-1136
Pin Count	1136	1136
Reach Compliance Code	not_compliant	compliant
ECCN Code	3A991.D	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Combinatorial Delay of a CLB-Max	0.77 ns	0.9 ns
JESD-30 Code	S-PBGA-B1136	S-PBGA-B1136
JESD-609 Code	e0	e1
Length	35 mm	35 mm
Moisture Sensitivity Level	4	4
Number of CLBs	8000	8000
Number of Inputs	640	640
Number of Logic Cells	102400	102400
Number of Outputs	640	640
Number of Terminals	1136	1136
Operating Temperature-Max	100 °C	100 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	8000 CLBS	8000 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1136,34X34,40	BGA1136,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225	245
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.25 mm	3.25 mm
Supply Voltage-Max	1.05 V	1.05 V
Supply Voltage-Min	0.95 V	0.95 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	TIN LEAD	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	35 mm	35 mm
Base Number Matches	2	2
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays