XC5VFX100T-1FFG1738C vs XC5VFX100T-3FF1738C feature comparison

XC5VFX100T-1FFG1738C AMD Xilinx

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XC5VFX100T-3FF1738C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1738 BGA-1738
Pin Count 1738 1738
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.9 ns 0.67 ns
JESD-30 Code S-PBGA-B1738 S-PBGA-B1738
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8000 8000
Number of Inputs 680 680
Number of Logic Cells 102400 102400
Number of Outputs 680 680
Number of Terminals 1738 1738
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 8000 CLBS 8000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1738,42X42,40 BGA1738,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.25 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

Compare XC5VFX100T-1FFG1738C with alternatives

Compare XC5VFX100T-3FF1738C with alternatives