Findchips: Compare XC4VLX40-11FF668C vs XC4VLX40-11FFG668C

XC4VLX40-11FF668C vs XC4VLX40-11FFG668C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No	Yes
Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	FBGA-668	LEAD FREE, FBGA-668
Pin Count	668	668
Reach Compliance Code	not_compliant	not_compliant
ECCN Code	3A991.D	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	52 Weeks	52 Weeks
Clock Frequency-Max	1205 MHz	1205 MHz
JESD-30 Code	S-PBGA-B668	S-PBGA-B668
JESD-609 Code	e0	e1
Length	27 mm	27 mm
Moisture Sensitivity Level	4	4
Number of CLBs	4608	4608
Number of Inputs	448	448
Number of Logic Cells	41472	41472
Number of Outputs	448	448
Number of Terminals	668	668
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	4608 CLBS	4608 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA668,26X26,40	BGA668,26X26,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.85 mm	2.85 mm
Supply Voltage-Max	1.26 V	1.26 V
Supply Voltage-Min	1.14 V	1.14 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	OTHER
Terminal Finish	TIN LEAD	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	27 mm	27 mm
Base Number Matches	2	2
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays