XC4VLX25-11FF668CS2
vs
XC4VLX25-11FF668C0968
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
XILINX INC
|
|
| Package Description |
BGA, BGA668,26X26,40
|
|
| Reach Compliance Code |
not_compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
1205 MHz
|
|
| Combinatorial Delay of a CLB-Max |
0.17 ns
|
|
| JESD-30 Code |
S-PBGA-B668
|
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
4
|
|
| Number of Inputs |
448
|
|
| Number of Logic Cells |
24192
|
|
| Number of Outputs |
448
|
|
| Number of Terminals |
668
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
2688 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA668,26X26,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Max |
1.26 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
|
|
|
|
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