XC4VLX25-10SF363C vs XC4VLX25-10SFG363C feature comparison

XC4VLX25-10SF363C AMD Xilinx

Buy Now Datasheet

XC4VLX25-10SFG363C AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-363 LEAD FREE, FBGA-363
Pin Count 363 363
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Clock Frequency-Max 1028 MHz 1028 MHz
JESD-30 Code S-PBGA-B363 S-PBGA-B363
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 4 4
Number of CLBs 2688 2688
Number of Inputs 240 240
Number of Logic Cells 24192 24192
Number of Outputs 240 240
Number of Terminals 363 363
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2688 CLBS 2688 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA363,20X20,32 BGA363,20X20,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 1.99 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 2 2

Compare XC4VLX25-10SF363C with alternatives

Compare XC4VLX25-10SFG363C with alternatives