XC4VLX15-11FF676CS2
vs
XC4VLX15-11FF668CS2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Base Number Matches |
1
|
1
|
Clock Frequency-Max |
|
1205 MHz
|
Combinatorial Delay of a CLB-Max |
|
0.17 ns
|
JESD-30 Code |
|
S-PBGA-B668
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
4
|
Number of Inputs |
|
320
|
Number of Logic Cells |
|
13824
|
Number of Outputs |
|
320
|
Number of Terminals |
|
668
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
1536 CLBS
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA668,26X26,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
|
225
|
Programmable Logic Type |
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
|
Not Qualified
|
Supply Voltage-Max |
|
1.26 V
|
Supply Voltage-Min |
|
1.14 V
|
Supply Voltage-Nom |
|
1.2 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XC4VLX15-11FF676CS2 with alternatives
Compare XC4VLX15-11FF668CS2 with alternatives