Findchips: Compare XC4VLX15-11FF668I vs XC4VLX15-11FF676I

XC4VLX15-11FF668I vs XC4VLX15-11FF676I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	ADVANCED MICRO DEVICES INC	XILINX INC
Package Description	FBGA-668	FBGA-676
Reach Compliance Code	not_compliant	not_compliant
Clock Frequency-Max	1205 MHz	1205 MHz
Combinatorial Delay of a CLB-Max	0.17 ns	0.17 ns
JESD-30 Code	S-PBGA-B668	S-PBGA-B676
JESD-609 Code	e0	e0
Length	27 mm	27 mm
Moisture Sensitivity Level	4	4
Number of CLBs	1536	1536
Number of Inputs	320	320
Number of Logic Cells	13824	13824
Number of Outputs	320	320
Number of Terminals	668	676
Operating Temperature-Max	100 °C	100 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	1536 CLBS	1536 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA668,26X26,40	BGA676,26X26,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.85 mm	3 mm
Supply Voltage-Max	1.26 V	1.26 V
Supply Voltage-Min	1.14 V	1.14 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN LEAD	Tin/Lead (Sn63Pb37)
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	27 mm	27 mm
Base Number Matches	2	1
Part Package Code		BGA
Pin Count		676
ECCN Code		3A991.D
HTS Code		8542.39.00.01
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays