Findchips: Compare XC4VFX60-12FFG1152CS1 vs XC4VFX60-12FF1152C

XC4VFX60-12FFG1152CS1 vs XC4VFX60-12FF1152C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes	No
Rohs Code	Yes	No
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Reach Compliance Code	not_compliant	not_compliant
ECCN Code	3A991.D	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	1181 MHz	1181 MHz
Combinatorial Delay of a CLB-Max	0.15 ns
JESD-30 Code	S-PBGA-B1152	S-PBGA-B1152
JESD-609 Code	e1	e0
Length	35 mm	35 mm
Moisture Sensitivity Level	4	4
Number of Inputs	576	576
Number of Logic Cells	56880	56880
Number of Outputs	576	576
Number of Terminals	1152	1152
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	6320 CLBS	6320 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1152,34X34,40	BGA1152,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	245	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.4 mm	3.4 mm
Supply Voltage-Max	1.26 V	1.26 V
Supply Voltage-Min	1.14 V	1.14 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN SILVER COPPER	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	35 mm	35 mm
Base Number Matches	1	2
Part Package Code		BGA
Package Description		FBGA-1152
Pin Count		1152
Number of CLBs		6320
Temperature Grade		OTHER
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays