XC4VFX60-12FFG1152C
vs
XC4VFX60-12FF1152CS1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
Package Description
LEAD FREE, FBGA-1152
BGA, BGA1152,34X34,40
Pin Count
1152
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1181 MHz
1181 MHz
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e1
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
6320
Number of Inputs
576
576
Number of Logic Cells
56880
56880
Number of Outputs
576
576
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
6320 CLBS
6320 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.4 mm
3.4 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
2
1
Combinatorial Delay of a CLB-Max
0.15 ns
Compare XC4VFX60-12FFG1152C with alternatives
Compare XC4VFX60-12FF1152CS1 with alternatives