XC4VFX140-10FF1760C
vs
XC4VFX140-10FFG1760C
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
|
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
|
Pin Count |
1760
|
1760
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B1760
|
S-PBGA-B1760
|
JESD-609 Code |
e0
|
e1
|
Length |
42.5 mm
|
42.5 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
15792
|
15792
|
Number of Terminals |
1760
|
1760
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
15792 CLBS
|
15792 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1760,42X42,40
|
BGA1760,42X42,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
42.5 mm
|
42.5 mm
|
Base Number Matches |
2
|
2
|
Clock Frequency-Max |
|
1028 MHz
|
Number of Inputs |
|
896
|
Number of Logic Cells |
|
142128
|
Number of Outputs |
|
896
|
|
|
|
Compare XC4VFX140-10FF1760C with alternatives
Compare XC4VFX140-10FFG1760C with alternatives