XC4085XLA-09BGG560I vs XC4052XL-09BG560C feature comparison

XC4085XLA-09BGG560I AMD Xilinx

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XC4052XL-09BG560C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 180000 GATES TYPICAL GATES = 33000-100000
Clock Frequency-Max 227 MHz 217 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.2 ns
JESD-30 Code S-PBGA-B560 R-PBGA-B560
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3136 1936
Number of Equivalent Gates 55000 33000
Number of Terminals 560 560
Organization 3136 CLBS, 55000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Number of Inputs 352
Number of Logic Cells 1936
Number of Outputs 352
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Equivalence Code BGA560,33X33,50
Temperature Grade OTHER

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