XC4085XLA-09BGG560C
vs
XC4085XLA-09BGG560I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
560
560
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAN ALSO USE 180000 GATES
CAN ALSO USE 180000 GATES
Clock Frequency-Max
227 MHz
227 MHz
Combinatorial Delay of a CLB-Max
1.1 ns
1.1 ns
JESD-30 Code
S-PBGA-B560
S-PBGA-B560
JESD-609 Code
e1
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3136
3136
Number of Equivalent Gates
55000
55000
Number of Inputs
448
448
Number of Outputs
448
448
Number of Terminals
560
560
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
3136 CLBS, 55000 GATES
3136 CLBS, 55000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
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