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XC4085XLA-08BGG560C vs XC4085XL-3BG560I feature comparison

XC4085XLA-08BGG560C AMD Xilinx

Buy Now Datasheet

XC4085XL-3BG560I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, PLASTIC, BGA-560
Pin Count 560 560
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 180000 GATES MAX USABLE 85000 LOGIC GATES
Clock Frequency-Max 263 MHz 166 MHz
Combinatorial Delay of a CLB-Max 1 ns 1.6 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3136 3136
Number of Equivalent Gates 55000 55000
Number of Inputs 448 448
Number of Outputs 448 448
Number of Terminals 560 560
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3136 CLBS, 55000 GATES 3136 CLBS, 55000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Number of Logic Cells 3136
Package Equivalence Code BGA560,33X33,50
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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