XC4085XLA-08BG560I vs XC4052XLA-09BGG560C feature comparison

XC4085XLA-08BG560I Rochester Electronics LLC

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XC4052XLA-09BGG560C AMD Xilinx

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 560 560
Reach Compliance Code unknown compliant
Additional Feature CAN ALSO USE 180000 GATES CAN ALSO USE 100000 GATES
Clock Frequency-Max 263 MHz 227 MHz
Combinatorial Delay of a CLB-Max 1 ns 1.1 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3136 1936
Number of Equivalent Gates 55000 33000
Number of Terminals 560 560
Organization 3136 CLBS, 55000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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