XC4062XLA-09BGG352I vs XC4085XLA-09BGG352C feature comparison

XC4062XLA-09BGG352I AMD Xilinx

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XC4085XLA-09BGG352C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, PLASTIC, BGA-352
Pin Count 352 352
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 130000 GATES CAN ALSO USE 180000 GATES
Clock Frequency-Max 227 MHz 227 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.1 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2304 3136
Number of Equivalent Gates 40000 55000
Number of Terminals 352 352
Organization 2304 CLBS, 40000 GATES 3136 CLBS, 55000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Pbfree Code Yes
Factory Lead Time 4 Weeks
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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Compare XC4085XLA-09BGG352C with alternatives