XC4062XLA-08BGG560I vs XC4062XL-2BGG560C feature comparison

XC4062XLA-08BGG560I AMD Xilinx

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XC4062XL-2BGG560C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 560 560
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 130000 GATES MAX USABLE 62000 LOGIC GATES
Clock Frequency-Max 263 MHz 179 MHz
Combinatorial Delay of a CLB-Max 1 ns 1.5 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e1 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2304 2304
Number of Equivalent Gates 40000 40000
Number of Inputs 384 384
Number of Outputs 384 384
Number of Terminals 560 560
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2304 CLBS, 40000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Pbfree Code Yes
Temperature Grade OTHER

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