XC4062XL-08BG560C vs XC4052XL-3BG560I feature comparison

XC4062XL-08BG560C AMD Xilinx

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XC4052XL-3BG560I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TYPICAL GATES = 40000-130000 MAX USABLE 52000 LOGIC GATES
Clock Frequency-Max 238 MHz 166 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.6 ns
JESD-30 Code R-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2304 1936
Number of Equivalent Gates 40000 33000
Number of Inputs 384 352
Number of Logic Cells 2304 1936
Number of Outputs 384 352
Number of Terminals 560 560
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 2304 CLBS, 40000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Part Package Code BGA
Package Description PLASTIC, BGA-560
Pin Count 560

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