XC4052XLA-09BG560C vs XC4052XL-1BGG560C feature comparison

XC4052XLA-09BG560C AMD Xilinx

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XC4052XL-1BGG560C AMD Xilinx

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-560 LBGA,
Pin Count 560 560
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 100000 GATES MAX USABLE 52000 LOGIC GATES
Clock Frequency-Max 227 MHz 200 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.3 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 1936
Number of Equivalent Gates 33000 33000
Number of Inputs 352 352
Number of Logic Cells 1936
Number of Outputs 352 352
Number of Terminals 560 560
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1936 CLBS, 33000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

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Compare XC4052XL-1BGG560C with alternatives