XC4052XLA-09BG560C
vs
XC4052XL-1BGG560C
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-560
LBGA,
Pin Count
560
560
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAN ALSO USE 100000 GATES
MAX USABLE 52000 LOGIC GATES
Clock Frequency-Max
227 MHz
200 MHz
Combinatorial Delay of a CLB-Max
1.1 ns
1.3 ns
JESD-30 Code
S-PBGA-B560
S-PBGA-B560
JESD-609 Code
e0
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1936
1936
Number of Equivalent Gates
33000
33000
Number of Inputs
352
352
Number of Logic Cells
1936
Number of Outputs
352
352
Number of Terminals
560
560
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1936 CLBS, 33000 GATES
1936 CLBS, 33000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA560,33X33,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Compare XC4052XLA-09BG560C with alternatives
Compare XC4052XL-1BGG560C with alternatives