XC4052XLA-08BGG352C vs XC4036XL-1BGG352I feature comparison

XC4052XLA-08BGG352C AMD Xilinx

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XC4036XL-1BGG352I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 352 352
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 100000 GATES MAX USABLE 36000 LOGIC GATES
Clock Frequency-Max 263 MHz 200 MHz
Combinatorial Delay of a CLB-Max 1 ns 1.3 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 1296
Number of Equivalent Gates 33000 22000
Number of Inputs 289 288
Number of Outputs 289 288
Number of Terminals 352 352
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1936 CLBS, 33000 GATES 1296 CLBS, 22000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

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Compare XC4036XL-1BGG352I with alternatives