XC4052XL-2BG560I
vs
XC4062XLA-08BGG560I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-560
LBGA,
Pin Count
560
560
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAX USABLE 52000 LOGIC GATES
CAN ALSO USE 130000 GATES
Clock Frequency-Max
179 MHz
263 MHz
Combinatorial Delay of a CLB-Max
1.5 ns
1 ns
JESD-30 Code
S-PBGA-B560
S-PBGA-B560
JESD-609 Code
e0
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1936
2304
Number of Equivalent Gates
33000
40000
Number of Inputs
352
384
Number of Logic Cells
1936
Number of Outputs
352
384
Number of Terminals
560
560
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1936 CLBS, 33000 GATES
2304 CLBS, 40000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA560,33X33,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Compare XC4052XL-2BG560I with alternatives
Compare XC4062XLA-08BGG560I with alternatives