XC4052XL-1BGG560C vs XC4085XL-2BGG560I feature comparison

XC4052XL-1BGG560C AMD Xilinx

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XC4085XL-2BGG560I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 560 560
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 52000 LOGIC GATES MAX USABLE 85000 LOGIC GATES
Clock Frequency-Max 200 MHz 179 MHz
Combinatorial Delay of a CLB-Max 1.3 ns 1.5 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e1 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 3136
Number of Equivalent Gates 33000 55000
Number of Inputs 352 448
Number of Outputs 352 448
Number of Terminals 560 560
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1936 CLBS, 33000 GATES 3136 CLBS, 55000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

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