XC4044XLA-09BGG432I vs XC4044XLA-09BG432I feature comparison

XC4044XLA-09BGG432I AMD Xilinx

Buy Now Datasheet

XC4044XLA-09BG432I AMD Xilinx

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, PLASTIC, BGA-432
Pin Count 432 432
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 80000 GATES CAN ALSO USE 80000 GATES
Clock Frequency-Max 227 MHz 227 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.1 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e1 e0
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1600 1600
Number of Equivalent Gates 27000 27000
Number of Inputs 320 320
Number of Outputs 320 320
Number of Terminals 432 432
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1600 CLBS, 27000 GATES 1600 CLBS, 27000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1
Number of Logic Cells 1600

Compare XC4044XLA-09BGG432I with alternatives

Compare XC4044XLA-09BG432I with alternatives