XC4044XL-1BGG352I
vs
XC4044XL-1BGG352C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
352
352
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAX USABLE 44000 LOGIC GATES
MAX USABLE 44000 LOGIC GATES
Clock Frequency-Max
200 MHz
200 MHz
Combinatorial Delay of a CLB-Max
1.3 ns
1.3 ns
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e1
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1600
1600
Number of Equivalent Gates
27000
27000
Number of Inputs
289
289
Number of Outputs
289
289
Number of Terminals
352
352
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1600 CLBS, 27000 GATES
1600 CLBS, 27000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
Temperature Grade
OTHER
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