XC4044XL-1BGG352I vs XC4036XLA-09BGG352C feature comparison

XC4044XL-1BGG352I AMD Xilinx

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XC4036XLA-09BGG352C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 352 352
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 44000 LOGIC GATES CAN ALSO USE 65000 GATES
Clock Frequency-Max 200 MHz 227 MHz
Combinatorial Delay of a CLB-Max 1.3 ns 1.1 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1600 1296
Number of Equivalent Gates 27000 22000
Number of Inputs 289 288
Number of Outputs 289 288
Number of Terminals 352 352
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1600 CLBS, 27000 GATES 1296 CLBS, 22000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Temperature Grade OTHER

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Compare XC4036XLA-09BGG352C with alternatives