XC4036XLA-08BG352C vs XC4044XL-1BGG352C feature comparison

XC4036XLA-08BG352C AMD Xilinx

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XC4044XL-1BGG352C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-352 LBGA,
Pin Count 352 352
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 65000 GATES MAX USABLE 44000 LOGIC GATES
Clock Frequency-Max 263 MHz 200 MHz
Combinatorial Delay of a CLB-Max 1 ns 1.3 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1296 1600
Number of Equivalent Gates 22000 27000
Number of Inputs 288
Number of Logic Cells 1296
Number of Outputs 288
Number of Terminals 352 352
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1296 CLBS, 22000 GATES 1600 CLBS, 27000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

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Compare XC4044XL-1BGG352C with alternatives