XC4036XL-3BG352I
vs
XC4036XL-2BGG352C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-352
LBGA,
Pin Count
352
352
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAX USABLE 36000 LOGIC GATES
MAX USABLE 36000 LOGIC GATES
Clock Frequency-Max
166 MHz
179 MHz
Combinatorial Delay of a CLB-Max
1.6 ns
1.5 ns
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1296
1296
Number of Equivalent Gates
22000
22000
Number of Inputs
288
288
Number of Logic Cells
1296
Number of Outputs
288
288
Number of Terminals
352
352
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1296 CLBS, 22000 GATES
1296 CLBS, 22000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
Temperature Grade
OTHER
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