XC4036XL-2BGG352C vs XC4052XLA-08BGG352C feature comparison

XC4036XL-2BGG352C AMD Xilinx

Buy Now Datasheet

XC4052XLA-08BGG352C AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 352 352
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 36000 LOGIC GATES CAN ALSO USE 100000 GATES
Clock Frequency-Max 179 MHz 263 MHz
Combinatorial Delay of a CLB-Max 1.5 ns 1 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1296 1936
Number of Equivalent Gates 22000 33000
Number of Inputs 288 289
Number of Outputs 288 289
Number of Terminals 352 352
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1296 CLBS, 22000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XC4036XL-2BGG352C with alternatives

Compare XC4052XLA-08BGG352C with alternatives