XC4028XL-2BG256I vs XC4028XLA-08BGG256I feature comparison

XC4028XL-2BG256I AMD Xilinx

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XC4028XLA-08BGG256I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-256 BGA,
Pin Count 256 256
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 28000 LOGIC GATES CAN ALSO USE 50000 GATES
Clock Frequency-Max 179 MHz 263 MHz
Combinatorial Delay of a CLB-Max 1.5 ns 1 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1024 1024
Number of Equivalent Gates 18000 18000
Number of Inputs 205 205
Number of Logic Cells 1024
Number of Outputs 205 205
Number of Terminals 256 256
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1024 CLBS, 18000 GATES 1024 CLBS, 18000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1
Pbfree Code Yes

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Compare XC4028XLA-08BGG256I with alternatives