XC4020XLA-09BG256I vs XCS40XL-4BGG256I feature comparison

XC4020XLA-09BG256I AMD Xilinx

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XCS40XL-4BGG256I AMD Xilinx

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-256 PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 40000 GATES MAXIMUM USABLE GATES 40000
Clock Frequency-Max 227 MHz 217 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.1 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 784 784
Number of Equivalent Gates 13000 13000
Number of Inputs 205 205
Number of Logic Cells 784 1862
Number of Outputs 205 205
Number of Terminals 256 256
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 784 CLBS, 13000 GATES 784 CLBS, 13000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1

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Compare XCS40XL-4BGG256I with alternatives