XC40150XV-09BG560C vs XC40150XV-07BG560C feature comparison

XC40150XV-09BG560C AMD Xilinx

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XC40150XV-07BG560C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-560 PLASTIC, BGA-560
Pin Count 560 560
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 300000 GATES CAN ALSO USE 300000 GATES
Clock Frequency-Max 225 MHz 296 MHz
Combinatorial Delay of a CLB-Max 1.3 ns 1 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5184 5184
Number of Equivalent Gates 100000 100000
Number of Inputs 448 448
Number of Logic Cells 5184 5184
Number of Outputs 448 448
Number of Terminals 560 560
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 5184 CLBS, 100000 GATES 5184 CLBS, 100000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

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Compare XC40150XV-07BG560C with alternatives