XC4013D-4BG225C
vs
XC4013E-1BG225I
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-225
|
BGA-225
|
Pin Count |
225
|
225
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
1536 FLIP-FLOPS; TYP. GATES = 10000-13000
|
|
Clock Frequency-Max |
133.3 MHz
|
166 MHz
|
Combinatorial Delay of a CLB-Max |
4 ns
|
|
JESD-30 Code |
S-PBGA-B225
|
S-PBGA-B225
|
JESD-609 Code |
e0
|
e0
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
576
|
576
|
Number of Equivalent Gates |
10000
|
10000
|
Number of Inputs |
192
|
192
|
Number of Logic Cells |
1368
|
1368
|
Number of Outputs |
192
|
192
|
Number of Terminals |
225
|
225
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
576 CLBS, 10000 GATES
|
576 CLBS, 10000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA225,15X15
|
BGA225,15X15
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.165 mm
|
2.55 mm
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.5 mm
|
1.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare XC4013D-4BG225C with alternatives
Compare XC4013E-1BG225I with alternatives