XC4013D-4BG225C vs XC4013E-1BG225I feature comparison

XC4013D-4BG225C AMD Xilinx

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XC4013E-1BG225I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-225 BGA-225
Pin Count 225 225
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1536 FLIP-FLOPS; TYP. GATES = 10000-13000
Clock Frequency-Max 133.3 MHz 166 MHz
Combinatorial Delay of a CLB-Max 4 ns
JESD-30 Code S-PBGA-B225 S-PBGA-B225
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 576 576
Number of Equivalent Gates 10000 10000
Number of Inputs 192 192
Number of Logic Cells 1368 1368
Number of Outputs 192 192
Number of Terminals 225 225
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 576 CLBS, 10000 GATES 576 CLBS, 10000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA225,15X15 BGA225,15X15
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.165 mm 2.55 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.5 mm 1.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1
Pbfree Code No

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