XC4010E-3BGG225C vs XC4010E-2BGG225C feature comparison

XC4010E-3BGG225C AMD Xilinx

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XC4010E-2BGG225C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 225 225
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 10000 LOGIC GATES MAX USABLE 10000 LOGIC GATES
Clock Frequency-Max 125 MHz 125 MHz
Combinatorial Delay of a CLB-Max 2 ns 1.6 ns
JESD-30 Code S-PBGA-B225 S-PBGA-B225
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 400 400
Number of Equivalent Gates 7000 7000
Number of Terminals 225 225
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 400 CLBS, 7000 GATES 400 CLBS, 7000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.5 mm 1.5 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 1

Compare XC4010E-3BGG225C with alternatives

Compare XC4010E-2BGG225C with alternatives