XC4010E-3BGG225C vs XC4010-6BG225I feature comparison

XC4010E-3BGG225C AMD Xilinx

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XC4010-6BG225I AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, PLASTIC, BGA-225
Pin Count 225 225
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 10000 LOGIC GATES 1120 FLIP-FLOPS; TYP. GATES = 8000-10000
Clock Frequency-Max 125 MHz 90.9 MHz
Combinatorial Delay of a CLB-Max 2 ns 6 ns
JESD-30 Code S-PBGA-B225 S-PBGA-B225
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 400 400
Number of Equivalent Gates 7000 8000
Number of Terminals 225 225
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 400 CLBS, 7000 GATES 400 CLBS, 8000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.165 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.5 mm 1.5 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 1
Number of Inputs 160
Number of Logic Cells 400
Number of Outputs 160
Package Equivalence Code BGA225,15X15
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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