XC4006E-2PQG208C
vs
XCS20-3PQG208C
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
FQFP,
|
FQFP,
|
| Pin Count |
208
|
208
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MAX USABLE 6000 LOGIC GATES
|
MAXIMUM USABLE GATES 20000
|
| Clock Frequency-Max |
125 MHz
|
125 MHz
|
| Combinatorial Delay of a CLB-Max |
1.6 ns
|
1.6 ns
|
| JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
| JESD-609 Code |
e3
|
e3
|
| Length |
28 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
256
|
400
|
| Number of Equivalent Gates |
4000
|
7000
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256 CLBS, 4000 GATES
|
400 CLBS, 7000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
4.1 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
28 mm
|
28 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC4006E-2PQG208C with alternatives
Compare XCS20-3PQG208C with alternatives