XC3SD1800A-4CS484C vs XC3SD1800A-5CS484C feature comparison

XC3SD1800A-4CS484C AMD Xilinx

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XC3SD1800A-5CS484C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description CSBGA-484 CSBGA-484
Pin Count 484 484
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 280 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.62 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e0
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4160 4160
Number of Equivalent Gates 1800000 1800000
Number of Inputs 309 309
Number of Logic Cells 37440 37440
Number of Outputs 249 249
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 4160 CLBS, 1800000 GATES 4160 CLBS, 1800000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 19 mm
Base Number Matches 1 1

Compare XC3SD1800A-4CS484C with alternatives

Compare XC3SD1800A-5CS484C with alternatives