XC3S700AN-4FGG484C
vs
XC3S700AN-4FG484I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
FBGA-484
FBGA-484
Pin Count
484
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Factory Lead Time
45 Weeks
Clock Frequency-Max
667 MHz
667 MHz
Combinatorial Delay of a CLB-Max
0.71 ns
0.71 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1472
1472
Number of Equivalent Gates
700000
700000
Number of Inputs
372
372
Number of Logic Cells
13248
13248
Number of Outputs
288
288
Number of Terminals
484
484
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
1472 CLBS, 700000 GATES
1472 CLBS, 700000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
Samacsys Manufacturer
AMD
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