XC3S700A-4FGG484C
vs
XC3S1000L-4FGG456C
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
FBGA-484
|
LEAD FREE, FBGA-456
|
Pin Count |
484
|
456
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.D
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
35 Weeks
|
|
Clock Frequency-Max |
667 MHz
|
|
Combinatorial Delay of a CLB-Max |
0.71 ns
|
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B456
|
JESD-609 Code |
e1
|
e1
|
Length |
23 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
1472
|
1920
|
Number of Equivalent Gates |
700000
|
1000000
|
Number of Inputs |
372
|
333
|
Number of Logic Cells |
13248
|
17280
|
Number of Outputs |
288
|
333
|
Number of Terminals |
484
|
456
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
1472 CLBS, 700000 GATES
|
1920 CLBS, 1000000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA484,22X22,40
|
BGA456,22X22,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.26 V
|
|
Supply Voltage-Min |
1.14 V
|
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
23 mm
|
23 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare XC3S700A-4FGG484C with alternatives
Compare XC3S1000L-4FGG456C with alternatives