XC3S700A-4FG484C vs XC3S1000-4FGG456I feature comparison

XC3S700A-4FG484C AMD Xilinx

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XC3S1000-4FGG456I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-484 23 X 23 MM, LEAD FREE, FBGA-456
Pin Count 484 456
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 35 Weeks 35 Weeks
Clock Frequency-Max 667 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.61 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B456
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1472 1920
Number of Equivalent Gates 700000 1000000
Number of Inputs 372 333
Number of Logic Cells 13248 17280
Number of Outputs 288 333
Number of Terminals 484 456
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1472 CLBS, 700000 GATES 1920 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XC3S700A-4FG484C with alternatives

Compare XC3S1000-4FGG456I with alternatives