XC3S500E-4CPG132CS1
vs
XC3S500E-4CPG132C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA132,14X14,20
CSP-132
Pin Count
132
132
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
572 MHz
572 MHz
Combinatorial Delay of a CLB-Max
0.76 ns
0.76 ns
JESD-30 Code
S-PBGA-B132
S-PBGA-B132
JESD-609 Code
e1
e1
Length
8 mm
8 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1164
1164
Number of Equivalent Gates
500000
500000
Number of Inputs
92
92
Number of Logic Cells
10476
10476
Number of Outputs
85
85
Number of Terminals
132
132
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1164 CLBS, 500000 GATES
1164 CLBS, 500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA132,14X14,20
BGA132,14X14,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
8 mm
8 mm
Base Number Matches
1
2
Pbfree Code
ECCN Code
EAR99
Factory Lead Time
52 Weeks
Compare XC3S500E-4CPG132CS1 with alternatives
Compare XC3S500E-4CPG132C with alternatives